Kemet Diamond Slurry
Classifying diamonds in-house! Introducing the characteristics of "water-based (W2)" and "oil-based (O3)" as well as the polishing targets!
"Kemet Diamond Slurry" offers a wide range of particle sizes, concentrations, and solutions to meet the needs of the lapping and polishing process. We provide two types of slurries: "Water-based (W2)," which has excellent cleaning properties and achieves a fast processing rate, and "Oil-based (O3)," which excels in lubrication and achieves a high surface roughness. Additionally, we can also provide slurries with other particle sizes. 【Features】 <Water-based (W2)> ■ Characteristics: Excellent cleaning properties and fast processing rate ■ Polishing targets: Sapphire, SiC, SUS304, SUS316, carbon, cemented carbide, ceramics, etc. <Oil-based (O3)> ■ Characteristics: Excellent lubrication and high surface roughness ■ Polishing targets: General iron-based materials, workpieces prone to rust *For more details, please refer to the PDF document or feel free to contact us.
- Company：北川グレステック 本社
- Price：Other
